The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...

The ball grid array (BGA) is a surface-mount chip package that is used to mount embedded devices (e.g. microprocessors) by melting balls of solder between the face of the device and the circuit board.

When designing printed circuit boards (PCBs), keep in mind the major causes of electronic failure: thermal cycling, vibration, and mechanical shock and drop. You can perform a variety of physical ...

This is the eleventh article in a series about my career experiences in the PCB design industry. During my relatively long employment at Mentor Graphics, I worked on many different projects. This ...

1. PCB design represents just one segment of a larger system design that starts with integrated-circuit fabrication. Higher-speed connections and SWaP (size, weight, and power) consistently raise the ...